发明名称 Method for fabricating semiconductor device
摘要 A p-type InGaAlN layer, an InGaAlN active layer, and an n-type InGaAlN layer each having a composition represented by (AlxGa1-x)yIn1-yN (0<=x<=1, 0<=y<=1) are formed on a sapphire substrate. In the as-grown state, Mg is bonded to hydrogen atoms in the p-type InGaAlN layer. Then, the back surface of the sapphire substrate is irradiated with a laser beam in a nitrogen atmosphere. The resistance of the p-type InGaAlN layer is reduced by removing hydrogen therefrom with irradiation with a weak laser beam. During the irradiation with the laser beam, the diffusion of a dopant in a multilayer portion is suppressed such that a dopant profile retains sharpness. It is also possible to separate the sapphire substrate from the multilayer portion by subsequently using an intense laser beam for irradiation.
申请公布号 US2003131788(A1) 申请公布日期 2003.07.17
申请号 US20020292713 申请日期 2002.11.13
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 UEDA TETSUZO
分类号 H01L21/205;H01L21/268;H01L33/00;H01L33/02;H01L33/32;H01S5/30;H01S5/323;(IPC1-7):H01L21/36;H01L21/322;C30B23/00;C30B28/12;C30B25/00;C30B1/00;C30B28/14;H01L21/20 主分类号 H01L21/205
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