| 摘要 |
Provided are an imaging unit, an imaging module, and an endoscopic system, which are capable of obtaining a high quality image while reducing the diameter of the front end of an insertion unit. This imaging unit 10 is provided with: a semiconductor package 20 which has an imaging element and in which a connection electrode 21 is formed on an f2 plane; a first laminate substrate 30 which has connection electrodes 31, 33 on planes f3 and f4 and is connected to the semiconductor package 20 through the connection electrode 31; a second laminate substrate 40, which is connected to the first laminate substrate 30 such that the lamination direction thereof is perpendicular to that of the first laminate substrate 30; an electronic component 51 embedded in the first laminate substrate 30; and a cable 60 connected to the second laminate substrate 40, the imaging unit being characterized in that the first and second laminate substrates 30 and 40 form a T shape in which the second laminate substrate 40 is connected to the first laminate substrate 30, and lie within a projection plane in the optical axis direction of the semiconductor package 20. |
