发明名称 POSITIVE RESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition for exposure with far UV adaptable to exposure in the far UV region using ArF or KrF as a light source in production of a semiconductor device, ensuring improved dimensional uniformity of a resist pattern and excellent also in various properties as a resist, such as resolving power, focal depth and development defects. <P>SOLUTION: The positive resist composition is characterized in that it contains (a) a polymer which has a silicon atom in a side chain, is insoluble or slightly soluble in an aqueous alkali solution and is made soluble in the aqueous alkali solution by the action of an acid and (b) a compound which generates an acid upon irradiation with an actinic ray or a radiation and has a specified phenacylsulfonium structure. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003207896(A) 申请公布日期 2003.07.25
申请号 JP20020007635 申请日期 2002.01.16
申请人 FUJI PHOTO FILM CO LTD 发明人 UENISHI KAZUYA;KODAMA KUNIHIKO
分类号 G03F7/039;C08F30/08;G03F7/004;G03F7/075;H01L21/027 主分类号 G03F7/039
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