| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a machining device for a wafer capable of machining it into a uniform thickness by preventing the lifting of the wafer under the machining. <P>SOLUTION: This machining device for the wafer is so formed that a suction pad 13 composed of a porous material is embedded in the upper surface part of a rotating table 1, and negative pressure passages 10 and 11 for applying a suction negative pressure to the whole lower surface of the wafer sucked by the suction pad. This device is provided with fluid feed means for jetting a pressurized fluid to the upper surface of the wafer. <P>COPYRIGHT: (C)2003,JPO |
