| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that a pasting position cannot be adjusted, since a semiconductor wafer and a frame body are firmly fixed by the adhesive force of an adhesive agent layer merely, by placing the semiconductor wafer and frame body to an adhesive sheet in the conventional fixing method of the semiconductor wafer, hence a product yield is reduced, since the semiconductor wafer is subjected to dicing while the pasting position is deviated. <P>SOLUTION: The fixing method for a semiconductor wafer has a ring-shaped frame body 1 and an adhesive sheet 2 that is applied onto one surface of the frame body 1, and applies a semiconductor wafer 3 to a surface, where the frame body 1 of the adhesive sheet 2 is not being applied for fixing. In this case, the adhesive sheet 2 has a support body 21 and an ultraviolet-curing adhesive layer 22, that is laminated on both the surfaces of the support body 21. <P>COPYRIGHT: (C)2003,JPO |
