发明名称 |
Microelectronics package |
摘要 |
A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
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申请公布号 |
US5753972(A) |
申请公布日期 |
1998.05.19 |
申请号 |
US19960645729 |
申请日期 |
1996.05.14 |
申请人 |
STRATEDGE CORPORATION |
发明人 |
WEIN, DEBORAH S.;ANDERSON, PAUL M.;LINDNER, ALAN W.;GOETZ, MARTIN;BABIARZ, JOSEPH |
分类号 |
H01L23/12;H01L21/00;H01L23/66;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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