| 摘要 |
A conductive molding composition (100), with a thermal conductivity above 22 W/m~K, is provided. The thermally conductive composition (100) includes a polymer base matrix (12) of, by volume, between 30 and 60 percent. A first thermally conductive filler (116), by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture (100) is a second thermally conductive filler (114), by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less. |
