| 摘要 |
PROBLEM TO BE SOLVED: To provide a plastic package, wherein deteriorations in performance and reliability of a device are not generated, despite a light shielding case being unnecessary. SOLUTION: This plastic package 1 is equipped with a photo device chip 6. The chip 6 having a light receiving part 9 and a signal processing part is mounted on a die area of a lead frame 3. The chip 6 is sealed in a molding resin 2, in this state. A thickness T2 of a mold resin covering a signal processing part forming area A2 is set at least about the thickness which can shield the greater part of a light entering the area A2. The thickness of mold resin covering a light receiving part forming area A1 is made relatively smaller than that of the mold resin covering the signal processing part forming area A2. |
