| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and the manufacture thereof by preventing a passivation film from cracking to improve reliability of tape automated bonding(TAB) mounting. SOLUTION: This device comprises pads 13, 14 made of a metal or high- melting point metal silicide which is less deformable than Al alloys on an insulation film 11 and metal bumps 19, 20 for thermocompression bonding to inner leads on the pads 13, 14. The metals here include Cu, Ta, Co, Ti, W, Mo, Ni or V, etc., and the high-melting point metal silicide includes Wsi, MoSi, NiSi or VSi, etc.</p> |
