发明名称 SEALING VESSEL FOR SEMICONDUCTOR MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To settle a case where a door is not closed for maintaining closure by sealing between the inside surface of a box and the end surface of a lid using a seal mechanism when the box and lid are engaged together. SOLUTION: When the opening surface of a box 11 is closed with a lid 10, the inside surface of the box 11 and the end surface of the lid 10 clamp a seal member 16 to leave a minute gap for inserting the lid 10. The lid 10 stops when the side surface of it approaches the end surface of the box 11 to hit a buffer material 15. When the lid 10 comes into engagement with the box 11, they do not directly contact each other for scraping because of presence of the seal member 16 of a seal mechanism. At closing of a vessel, the seal member 16 of the seal mechanism expands to seal the gap between the box 11 and the lid 10 over the entire circumference.</p>
申请公布号 JP2000357727(A) 申请公布日期 2000.12.26
申请号 JP19990167345 申请日期 1999.06.14
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC 发明人 MITSUSHIMA TAKESHI
分类号 B65D85/86;H01L21/673;H01L21/68;H01L23/02;(IPC1-7):H01L21/68 主分类号 B65D85/86
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