| 摘要 |
PROBLEM TO BE SOLVED: To provide the bonding device and tool of electronic components that allow stable vibration at low costs for bonding. SOLUTION: In this bonding tool for pressing onto a surface while a load and vibration are operating on the electronic components, first and second grooves 15d and 15f having sets of convex tapered surfaces 15e and 15g, respectively, are provided on a surface at the pressing side of a horn 15 and a surface at the opposite side, and a convex tapered surface 30c at a suction part 30 having a junction operation part 30a and a convex tapered surface 34a of a fitting member 34 are brought into contact with the projection-tapered surfaces 15e and 15g of the first and second grooves 15d and 15f, respectively, and are tightened with a screw member 33 for adhesion, thus symmetrically setting joining force operating on the horn 15 up and down, and hence preventing the horn 15 from being deformed by the joining force.
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