发明名称 |
METHOD OF INTEGRATING A HEAT SPREADER AND A SEMICONDUCTOR, AND PACKAGE FORMED THEREBY |
摘要 |
A method of integrating a heat speader into a semiconductor package includes depositing an adhesion metal layer on the back of a wafer at low temperature. A heat transfer metal layer is subsequently deposited on the adhesion metal layer at low temperature to form a heat spreader. |
申请公布号 |
WO02056376(A2) |
申请公布日期 |
2002.07.18 |
申请号 |
WO2001US51198 |
申请日期 |
2001.11.13 |
申请人 |
SUN MICROSYSTEMS, INC. |
发明人 |
DAVIDSON, HOWARD, L.;LYTEL, RICHARD |
分类号 |
H01L21/48;H01L23/373 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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