| 摘要 |
A thin metallised inorganic/polymeric dielectric substrate (24) is clad on both sides with metal, for fabrication into a resonant circuit tag (20). The dielectric layer contains a via hole (31) there throu7gh, and is formed directly on a first conductive foil layer. A second conductive metal layer is deposited on the dielectric layer and in the via hole to interconnect the two conductive layers. This construction is subsequently etched into an inductor (28) and capacitor plates (27, 29) of the circuit using an etch resist. The circuit's deactivation reliability is enhanced by the uniformity/consistency of the substrate's critical breakdown thickness bY non-mechanical means. It also eliminates the need to devote tag surgace area for a mechanical interconnect, and permits a smaller capacitor plate to maximize the available surface area for inductor coil turns, thereby enhancing the inductance and detection range of a given size tag or to produce smaller tags with the same detection range. |
