发明名称 |
Cooling of electronics by electrically conducting fluids |
摘要 |
Apparatus to provide effective removal of heat from a high power density device. The apparatus has a heat spreader and a heat sink structure. The heat spreader is divided into one or more chambers. Electromagnetic pumps are placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chamber. The liquid metal preferably is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area (over the high power density device) and distributes it over the entire spreader. This results in a uniform distribution of heat on the base of the heat sink structure and hence effective removal of heat by the heat sink structure.
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申请公布号 |
US2004182088(A1) |
申请公布日期 |
2004.09.23 |
申请号 |
US20040768767 |
申请日期 |
2004.01.30 |
申请人 |
NANOCOOLERS, INC. |
发明人 |
GHOSHAL UTTAM;MINER ANDREW CARL |
分类号 |
H01L23/473;H01L23/552;H01L35/30;(IPC1-7):F25B21/02 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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