| 摘要 |
<P>PROBLEM TO BE SOLVED: To develop a bonding tool optimum for an insulator-coated bonding wire for preventing a circuit from short circuiting in highly integrated and closely gathered wirings by multipl wirings in an electronic device, and to provide a method for bonding the same. <P>SOLUTION: The bonding tool comprises a tip having a diameter (T) of a bottom and a roundness (OR) of an outer periphery of the bottom such that when the diameter (T) is 120 μm or larger, the roundness (OR) is 15 μm or smaller, and when the T does not exceed 120 μm, the OR is 10 μm or smaller. Bonding by using the tool is effective by using an ultrasonic previous oscillation method, and the use of an insulator-coated bonding wire further exhibits effects when the wire made of a thermoplastic resin. <P>COPYRIGHT: (C)2003,JPO |
