| 摘要 |
An assembly of a semiconductor device and a heat radiating plate and a manufacturing method thereof are provided to improve heat radiating characteristics by bonding the semiconductor device and the heat radiating plate using a metal. A semiconductor device(100) fixed with a base member(101) made of metal and a metal heat radiating plate(102) for being bonded to the base member are prepared. A solder is interposed at a predetermined portion between one surface of the metal heat radiating plate and the base member. A solder welding process is performed on the base member and the metal heat radiating plate by heating the solder. An aluminum plate coated with nickel is used as the metal heat radiating plate. The solder welding process on the solder is performed through a pre-heating step, a melting step and a post-heating step.
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