发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition excellent in fluidity and giving moldings excellent in anti-blistering property, mechanical strength, and sliding property. SOLUTION: This polyamide resin composition contains 100 parts by weight polyamide resin having a melting point of 270°C-340°C (A), 0.2-20 parts by weight compound represented by formula (I) (wherein R<SP>1</SP>and R<SP>2</SP>each represent an alkyl group having not less than 9 carbons, and m and n each represent an integer of 1-3) (B), and 1-100 parts by weight bromine flame-retardant (C). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008208383(A) 申请公布日期 2008.09.11
申请号 JP20080149216 申请日期 2008.06.06
申请人 KURARAY CO LTD;ADEKA CORP 发明人 MATSUOKA HIDEJI;OKA HIDEAKI;UCHIDA KOICHI;TSUZUKI MASAHIDE;BEPPU KOJI
分类号 C08L77/00;C08K3/00;C08K5/00;C08K5/03;C08K5/103;C08K5/105;C08L77/02;C08L77/06 主分类号 C08L77/00
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