| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fixed abrasive grain foam for polishing having small polishing performance dispersion and high polishing accuracy in a CMP process, easily enlarged in response to extended diameter of a wafer, and largely reducing dressing period. <P>SOLUTION: In the fixed abrasive grain foam for polishing, the cross section in the thickness direction of a foam sheet spirally wound and fixed via a bonding layer 13 having dispersed abrasive grains 15 is set as a polishing surface. An average diameter of air bubbles 14 contained in the foam sheet is not less than 0.1 μm and less than 300 μm, and main material constituting the foam sheet is thermoplastic polyuretane, and the bonding layer is a polyuretane based adhesive made of a curing agent having water solubility and/or water dispersibility. <P>COPYRIGHT: (C)2003,JPO |
