POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING, METHOD FOR FORMING CURED FILM USING THE SAME, CURED FILM AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a positive photosensitive resin composition for spray coating, which is used for forming a coating film by spray coating the positive photosensitive resin composition over a substrate such as a semiconductor device mounting substrate, a ceramic substrate or an aluminum substrate. This positive photosensitive resin composition for spray coating is characterized by containing an alkali-soluble resin (A), a compound (B) generating an acid by the action of light and a solvent (C), and having a viscosity of 2-200 cP.