| 摘要 |
PROBLEM TO BE SOLVED: To provide a blade tool used in a workpiece cutting device for slicing a workpiece (work) such as a semiconductor single-crystal ingot, a manufacturing method of the blade tool, and a cutting method of the workpiece by the blade tool. SOLUTION: An abrasive grain containing fiber member 2 having uniform abrasive grains Q is woven, and is cured like a plate to form the blade tool 1. The blade tool 1 is manufactured in a weaving process of weaving the fiber member 2 having uniform abrasive grains Q in a vertical and lateral lattice shape or diagonally, a coating process of coating the woven fiber member 2 with thermosetting resin, and a curing process of passing the woven fiber member 2 between a pair of rollers to cure it like a plate. Then, the blade tool 1 is fixed to the lower surface of a pedestal 11 of an oscillating device movable back and forth in the horizontal direction for example, and the moving blade tool 1 is pressed to the workpiece (work P) to cut the workpiece (work P). COPYRIGHT: (C)2003,JPO |
