发明名称 Bonding method and bonding apparatus
摘要 A tip of a wire is formed in a shape of a ball, the wire being inserted into and fed out of a first tool. The tip is bonded to a first electrode by using the first tool. The wire is drawn from the first tool and a part of the wire is bonded to a second electrode by using the first tool. The wire is held by a second tool disposed above the first tool, and cut in a state to allow the part of the wire to remain on the second electrode. The wire is fed out of the first tool by positioning the first and second tools relatively closer to each other while holding the wire by the second tool.
申请公布号 US2003162378(A1) 申请公布日期 2003.08.28
申请号 US20020320535 申请日期 2002.12.17
申请人 SEIKO EPSON CORPORATION 发明人 MIKAMI KUNIMITSU
分类号 H01L21/60;B23K20/00;B23K31/00;H01L21/00;H01L21/44;H01L21/607;(IPC1-7):H01L21/44 主分类号 H01L21/60
代理机构 代理人
主权项
地址