| 发明名称 |
COMPONENT MOUNTING APPARATUS, COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING LINE |
| 摘要 |
A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal. |
| 申请公布号 |
US2016234984(A1) |
申请公布日期 |
2016.08.11 |
| 申请号 |
US201514868885 |
申请日期 |
2015.09.29 |
| 申请人 |
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
发明人 |
ITOH Katsuhiko;IKEDA Masanori;OKAMOTO Kenji |
| 分类号 |
H05K13/04;H05K3/30 |
主分类号 |
H05K13/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A component mounting apparatus comprising:
a mounting unit that mounts an electronic component on a board; at least one component supply unit that supplies chip solder; and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal. |
| 地址 |
Osaka JP |
