THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE

摘要

Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling proccessability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

主权项

1. A method for manufacturing a wiring board to be used for semiconductor packages, comprising a step of drilling processing for drilling a hole in a copper clad laminate plate,
wherein the copper clad laminate plate comprises a thermosetting resin composition comprising (A) a maleimide compound, (B) a thermosetting resin, (C) an inorganic filler, and (D) a molybdenum compound.