Wire bonded IC components to round wire

摘要

A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.

主权项

1. A circuit arrangement, comprising:
a substrate; an integrated circuit (IC) component attached to the substrate; one or more round wire segments attached to the substrate, the one or more round wire segments having first and second portions for connecting to the IC component, and each of the first and second portions having a respective planar landing area extending longitudinally along the one or more round wire segments; wherein each of the one or more round wire segments has a round cross section; and bond wires directly connected to the respective planar landing areas and to the IC component.