Stacked damascene structures for microelectronic devices

摘要

A microelectronic device includes a dual-damascene interconnect structure and a single-damascene line structure directly on the dual-damascene interconnect structure. The dual-damascene interconnect structure and the single-damascene line structure may each include multiple line segments that are arranged in a brick wall pattern. The brick wall pattern may also be used with two or more single-damascene line structures. Various microelectronic devices and related fabrication methods are described.

主权项

1. A microelectronic device comprising:
a microelectronic substrate; a dual-damascene interconnect structure on the microelectronic substrate, the dual-damascene interconnect structure comprising a conductive via and a first conductive line directly on the conductive via opposite the microelectronic substrate; and a single-damascene line structure directly on the dual-damascene interconnect structure, the single-damascene line structure comprising a second conductive line on the first conductive line opposite the conductive via.