| 摘要 |
PURPOSE:To avoid failures such as a circuit defect and a contact defect caused by the coming-off of an electronic component by a method wherein flexible printed wiring boards on which circuit patterns are formed are wound around a base board on which the component is mounted and bonded to it and then the leads of the component are connected to the circuit patterns. CONSTITUTION:A burying hole 4 or a burying recess is provided in an insulating board 3 which is to be the base of a circuit board and an electronic component 1 is buried in it. First, second and third flexible printed wiring hoards 10a-10c on which circuit patterns 5 which are to be connected to the leads 2 provided on the electronic component 1 are formed are wound around the insulating board 3 and bonded to it. After that, the leads 2 are connected to the circuit patterns 5 to improve the support stability of the electronic component. With this constitution, failures such as a circuit defect and a contact defect which are caused by the coming-off of the electronic component can be avoided. |
