VERFAHREN ZUR HERSTELLUNG EINER PRINTPLATINE

摘要

A process for producing a printed circuit board which can mainly shield electromagnetic waves generated therefrom, a printed circuit board having printed thereon printed devices, a multilayered printed circuit board, or a printed circuit board for mounting chip devices, all of which have high reliability, using a printed circuit board obtained by preparing a semicured resin-based copper-clad laminate by continuous pressing by means of a double-belt pressing method or a batch-wise continuous pressing in which one laminate is produced by press molding between a pair of hot platens, the semicured resin-based copper-clad laminate having a copper foil peel strength of 0.2 kg/cm or more, preferably 0.3 kg/cm or more, and 90% or less of the peel strength thereof as measured after the resin is completely cured, subsequently forming a predetermined printed circuit by etching, and then pressing the resulting semicured resin-based printed circuit board, thereby to exist the conductor surface on almost the same level with the substrate surface.