发明名称 OPTICAL LINK MODULE AND OPTICAL LINK MODULE BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an optical link module and an optical link module board having a structure for improving the integration and production efficiency without increasing the module in scale. <P>SOLUTION: This optical link module 10 is equipped with a light emitting element assembly 12, a light receiving element assembly 14, a plurality of electronic components, and a board 24 having main surfaces 24a and 24b facing each other. A plurality of the electronic components is mounted on both the main surfaces 24a and 24b of the board 24, and the electronic components which require wiring are mounted only on either the first main surface 24a or the second main surface 24b. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003258273(A) 申请公布日期 2003.09.12
申请号 JP20020059077 申请日期 2002.03.05
申请人 SUMITOMO ELECTRIC IND LTD 发明人 INUSHIMA KOUNO;OKI KAZUE;KURASHIMA HIROMI;TSUMURA HIDESHI
分类号 H01L33/00;G02B6/42;H01L31/02;H01S5/022;H05K1/18 主分类号 H01L33/00
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