发明名称 |
METHOD OF FORMING PHOTOSENSITIVE LAYER AND APPARATUS FOR THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a photosensitive layer which enables the simultaneous coating of both surfaces of even a thick substrate having a thickness ranging from 0.1 mm to 0.8 mm thickness by a die coating method and by which the substrate having a uniform film thickness distribution in the substrate surface is stably obtained and the incorporation of foreign matters into a photosensitive layer is suppressed to the utmost. <P>SOLUTION: Before coating, the foreign matter stuck on the substrate is removed and the photosensitive layer is formed by moving at least one of the substrate and a coating liquid discharge means relatively to each other in a state that the end part of the substrate is held. <P>COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003251248(A) |
申请公布日期 |
2003.09.09 |
申请号 |
JP20020054312 |
申请日期 |
2002.02.28 |
申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
NAZUKA MASANORI;HYODO KENJI |
分类号 |
G03F7/16;B05C5/02;B05C9/10;B05C13/02;B05D1/26;B05D7/00;H05K3/00;H05K3/06;H05K3/28 |
主分类号 |
G03F7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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