发明名称 METHOD OF FORMING PHOTOSENSITIVE LAYER AND APPARATUS FOR THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a photosensitive layer which enables the simultaneous coating of both surfaces of even a thick substrate having a thickness ranging from 0.1 mm to 0.8 mm thickness by a die coating method and by which the substrate having a uniform film thickness distribution in the substrate surface is stably obtained and the incorporation of foreign matters into a photosensitive layer is suppressed to the utmost. <P>SOLUTION: Before coating, the foreign matter stuck on the substrate is removed and the photosensitive layer is formed by moving at least one of the substrate and a coating liquid discharge means relatively to each other in a state that the end part of the substrate is held. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003251248(A) 申请公布日期 2003.09.09
申请号 JP20020054312 申请日期 2002.02.28
申请人 MITSUBISHI PAPER MILLS LTD 发明人 NAZUKA MASANORI;HYODO KENJI
分类号 G03F7/16;B05C5/02;B05C9/10;B05C13/02;B05D1/26;B05D7/00;H05K3/00;H05K3/06;H05K3/28 主分类号 G03F7/16
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