发明名称 |
SEMICONDUCTOR DEVICE HAVING MULTIPLE ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: A semiconductor device having multiple isolation structure and a method for manufacturing the same are provided to be capable of obtaining high driving voltage, good device isolation ability and small device isolation area. CONSTITUTION: The first conductive type buried layer(60) is formed in a semiconductor substrate(50). The first conductive type epitaxial layer(62) is formed on the resultant structure. A device isolation structure(90) that defines a device region through the epitaxial layer and the substrate is disposed. A field oxide layer(70) is formed on the device region to define the first and second active region(a1,a2). A gate electrode(80) is formed on the first active region(a1). A source and drain region are formed in the first and second active region. At the time, the device isolation structure(90) further includes a lower isolation structure(58) and an upper isolation structure(68).
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申请公布号 |
KR20030072069(A) |
申请公布日期 |
2003.09.13 |
申请号 |
KR20020011621 |
申请日期 |
2002.03.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN, HWA SUK;YOO, GWANG DONG |
分类号 |
H01L21/76;H01L21/761;H01L21/762;H01L21/8249;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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