摘要 |
A liquid curable resin composition comprising (1) a (meth)acrylate polymer having a weight average molecular weight relative to polystyrene standard of at least about 5,000, (2) a ring-opening polymerizable monomer containing at least one epoxy group, and (3) a cationic photopolymerization initiator is disclosed. The composition produces cured products which exhibit superior heat resistance, excellent mechanical strength, and superb adhesive characteristics, and is suitable for use as a photo-curable adhesive, a photo-curable sealing material, a resin for optical three-dimensional molding, and a coating material for optical fibers, and optical fiber ribbon matrix. |