Soldering or housing electronic or hybrid assembly

摘要

A process for soldering assembled electronic or hybrid components and/or for housing such components involves (a) assembling and fixing the components and optionally the housing in a predetermined position; (b) introducing the assembly into a chamber and then evacuating the chamber; (c) supplying a process gas (mixture) to obtain a chamber pressure of 0.1-10 mbars; (d) simultaneously heating the chamber and activating the process gas (mixture) to form a low pressure plasma; (e) terminating heating and plasma formation after the solder has melted; and (f) increasing the chamber pressure so that the positions of the components and the housing remain fixed during cooling.