| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-forming device for an electronic part which forms a lead wire of an electronic part with small lead pitches without especially requiring rigidity of a molding die, in a simple structure. SOLUTION: This lead forming device comprises a first molding die 1, which is provided between a second molding die 2 and a third molding die 3 held by a second die holder 5 and a third die holder 5, respectively, provided with a roller 11 on it lower end, urged by a spring 13 and allowed to rotate by a shaft 7, and which is held by a first die holder of self-aligning structure in which oscillation and horizontal movement are free, a pusher 12, allowed vertical movement, which, by bring its tip into contact with the roller 11, rotates the second molding die 2 and the third molding die 3, to form a lead wire 9 bridging the first molding die 1 by sandwiching and pressurizing, and a pair of plunger 15 having a pin 15a. |
