| 摘要 |
PROBLEM TO BE SOLVED: To obtain a column grid array semiconductor package and a manufacturing method. SOLUTION: This method includes a step of supplying substrate material having a first side and a second side, a step of forming plural holes 236 in the substrate 214, a step of forming a contact point on a first surface of the substrate 214 and a step of filling the holes 236 by conductive material 232 as far as a range of forming a extending part on the second side of the substrate 214 where an electrical contact point can be made. The extending part 228 can be coated with capping material. The filling of the holes 236 can be made by placing material which covers the holes 236 on the first side of the substrate 214 and by filling the holes 236 by the conductive material 228, and them resist is eliminated. |
