| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a sheet-feed wafer etching apparatus, whereby a flat etching surface can be obtained, instead of an uneven surface which has been a problem in the conventional sheet-feed wafer etching apparatus of the spray nozzle system. SOLUTION: This sheet-feeding wafer etching apparatus for etching wafers one by one comprises a rotatable surface table 2 with a pasted moisture holding sheet 5, etching liq. feed mechanism, 3 for feeding an etching liquid to the moisture holding sheet 5, and wafer hold mechanism for holding a wafer W, and operates to contact one surface of the wafer held by the wafer holding mechanism to the moisture holding sheet 5 which is always impregnated with an etching liquid to etch the one surface of the wafer W. In the wafer etching apparatus, the surface table 2 with the pasted moisture holding sheet 5 is rotated so as to contact with one surface of the wafer held by the wafer hold mechanism to the moisture holding sheet 5 always impregnated with an etching liquid to etch the one surface of the wafer W.</p> |
