| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a surface-mounting type semiconductor device that can adequately radiate heat in the surface-mount-type semiconductor device, and the semiconductor device. SOLUTION: A surface-mounting type semiconductor device is provided with an electrically insulated substrate 10 with a through-hole H2, metal electrodes 21 and 22 which are provided on the surface of the electrically insulated substrate 10 so that the opening at one side of the through-hole H2 can be covered, and a semiconductor element 30 that is arranged in the through-hole H2 and moreover is soldered to the metal electrodes 21 and 22.</p> |
