DIRECT VIEW INFRARED MEMS STRUCTURE

摘要

An apparatus and process for forming an infrared imager suitable for night vision surveillance systems. The infrared imager includes an array of field emissive devices formed within a semiconductor substrate (200) such as a silicon wafer. The field emissive devices each include silicon emitters formed within the silicon substrate (200) and a micro-cantilever (245) including a conductive gate plate (275) suspended above the emitters. The micro-cantilever (245) is formed of a bi-material and bends in response to absorbed infrared radiation, locally changing an electric field applied to the structure, and therefore, the emission current of the emitters. Electrons emitted from the emitters form a visible image on a phosphor plate.