| 摘要 |
A wire saw (10) having a cutter for a slicing base, capable of cutting off a plurality of wafers, which have been cut off from a work, from a slicing base without requiring labor, wherein a cutter (60) for the slicing base is provided in a machine body of the wire saw (10) so as to cut off a plurality of wafers (28, 28...), which have been cut off with rows of wires comprising a plurality of wires (24), from the slicing base (30) with the cutter (60), whereby the wafers (28, 28...) cut off with the rows of wires can be cut off inside the machine body of the wire saw (10) without taking the wafers out of the machine body.
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