| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized, thin-type IC socket allowing use as an IC socket for a surface-mounted IC having BGA terminals. SOLUTION: In this IC socket, socket base body 1 has a group of upper contact pins 12 each energized inside the socket base body 1 at a position corresponding to each terminal position of a BGA type IC placed and housed on the upper surface of the socket base body 1 and projecting by a constant length from the upper surface of the socket base body 1, and a group of lower contact pins each energized inside the socket base body 1 and projecting by a constant length from the lower surface of the socket base body 1 at a position corresponding to an IC terminal connection electrode formed on a mounting printed circuit board C. An external connection printed circuit board 3 has through holes through which the group of the upper contact pins 12 are respectively inserted, and surface wiring parts individually electrically connected to the group of the upper contact pins 12, formed on a surface of the external connection printed circuit board 3 and extended to an outer edge part, and insulated from each other. |
