| 摘要 |
PROBLEM TO BE SOLVED: To select the most appropriate means of mounting electronic components for an electronic circuit device. SOLUTION: A semiconductor device 121 is provided with a package substrate 5, soldered to solder bumps 3 of a CSP-mounted semiconductor chip 4, and thereby integrated with the chip 4 is structured so that either a surface mounting means or a contact mounting means can be used selectively. The surface mounting means allows, for example, mounting of the semiconductor device 121 on a printed circuit board 12 of an electronic circuit device by means of solder bumps 9. By forming a recessed spherical contact 11 on the sidewall face of the package substrate 5 and installing a socket, for example, one having a train of contact pieces, suitable for the contact 11 on the circuit board 12, the contact mounting means can be also used selectively. |
