| 摘要 |
PROBLEM TO BE SOLVED: To eliminate reflection of a signal due to impedance mismatching at a bonding part and thereby improve transmission characteristics, by extending the top end of a coaxial connector close to a semiconductor chip in a package cavity and forming a pad for wire-bonding on the center core and on the outer conductor, respectively. SOLUTION: A coaxial cable 32 is mounted on a package from its outside via a coaxial connector 30. The coaxial connector 30 is extended to the package inside to form a top end member 50 with the center core 34 and the outer conductor 42 of the connector. The top end of the center core 34 of the connector is connected to a semiconductor chip 12 of a high-frequency device by a bonding wire 24. In the output side, the signal is transmitted from the semiconductor chip 12 to an external terminal via a substrate transmission line 52. By such means, reflection of a signal due to impedance mismatching at the bonding is eliminated, thereby improving the transmission characteristics of the overall line. |
