ASSEMBLED SUBSTRATE FOR PIEZOELECTRIC DEVICE, PIEZOELECTRIC DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To perform operations including measurement, etc., by performing feeding on the basis of an assembled substrate on which individual substrates are arranged.

SOLUTION: Wiring 28 is formed in a through hole 2c at a corner of a ceramic substrate 2 and is connected with a corner electrode 22c on a lower surface of the substrate. One wiring layer 22 as two terminal electrodes is formed close to a first side as a short side of the ceramic substrate 2 and the other wiring layer 22 is formed close to a third side as a short side opposed to the first side. One wiring layer 22 is conducted on a side electrode formed in a through hole 2d on a break line 29 of the first side via an extended part 22a and the other wiring layer 22 is conducted on the side electrode formed in a through hole 2d on a break line 29 of the third side via the extended part 22a. The wiring layer 22 is cut off from the corner electrode 22c.

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