| 摘要 |
PROBLEM TO BE SOLVED: To largely improve precision and efficiency in parametric test of a semiconductor device, which detects a defective part on a wafer, conducts a more minute test on the defective part and searches for the cause with a simpler procedure. SOLUTION: The semiconductor parametric test device is provided with functions designating dies 107 and 20 and modules 106 and 21 on the wafers, which are to temporarily be stopped during the test, and the device temporally stops the test in a predetermined dies and modules.
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