发明名称 LEAD FRAME TRANSFER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a lead frame transfer device, capable of preventing malfunction due to overheating, even if lead frames are stopped on a heat block. SOLUTION: Rails 11 and 11 of an upstream rail section 12 are connected to rails 11 and 11 of a downstream rail section 13 by connection rails 14 and 14, and an opening space 15 is formed between the rail sections 12 and 13. A heating block 16, for heating lead frames 2 on a transferring path 3, is provided in the opening space 15, and the heating block 16 is supported movably in the vertical directions by a lift device 17.
申请公布号 JP2002016089(A) 申请公布日期 2002.01.18
申请号 JP20000197586 申请日期 2000.06.30
申请人 NIDEC TOSOK CORP 发明人 KANEKO KAZUKI
分类号 H01L21/52;H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/52
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