| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing electronic components with highly hermetic reliability without generating delaminations of a metal frame by tightly bonding the metal frame to a metallization layer for brazing. SOLUTION: In the package for housing electronic components, the metal frame 2 with a substantially square-frame shape formed by punching a rolled metal plate is mounted so as to surround a mounting area 1a on the matallization layer 5 for brazing, on an insulation substrate 1 having a mounting area 1a where the electronic components are mounted thereon and the substantially square-frame shaped metallization layer 5 for brazing surrounding the mounting area 1a, and a metal lid 3 is bonded on the metal frame 2. The metal frame 2 is punched so that each side is at substantially 45 degrees to the rolled direction of the rolled metal plate.
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