| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a measuring method and device by which an internal machining process of a transparent sample can be observed in detail by laser. SOLUTION: In measuring an internal machining process of a transparent sample by laser, the device is equipped with a machining laser 1 for forming a fundamental wave for laser beam machining, a measuring laser 21 for forming a frequency-multiplied waves of the fundamental wave as a measuring beam, a time difference generator 22 for delaying the frequency-multiplied waves, a transparent sample 6 to be irradiated with the fundamental wave and the frequency-multiplied waves, a filter 9 for transmitting only a measuring beam from the transparent sample 6, and an image pickup unit 10 for picking up the image of the measuring beam passing the filter 9.</p> |
