METHOD FOR PRODUCING AN ELECTRONIC COMPONENT OR MODULE AND A CORRESPONDING COMPONENT OR MODULE

摘要

The invention relates to a method for producing a component or a module comprising a component assembly arranged on a substrate in a housing which is mountable on a printed circuit. The inventive method consists of at least one stage when at least one part of the module is coated with an insulating material, and at least one stage when at least one conductive area is produced on one part of said insulating material in such a way that the areas forming and/or receiving at least one part of the component and/or at least one interconnection element are defined.