METAL SURFACE PROCESSING METHOD, METHOD OF MANUFACTURING MULTILAYER CIRCUIT SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a multilayer circuit board (motherboard or semiconductor chip mounting board) capable of ensuring high bonding strength between an interlayer insulating layer and wiring without forming an unevenness having a thickness of almost exceeding 1μm and efficiently transmitting a high-speed electric signal, and to provide a method of manufacturing a semiconductor package or the like.

SOLUTION: The method of manufacturing a multilayer wiring board for forming a plurality of interlayer insulating layers and wiring on one side or both sides of a core substrate has steps of processing the surface of the wiring with a solution containing an imidazole-type silane coupling agent, cleaning it with water, and then drying it at a temperature of less than 50°C.

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