Flip-chip package device and method of manufacturing the same,申请号KR19980028116-传众专利搜索

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发明名称	Flip-chip package device and method of manufacturing the same
摘要
申请公布号	KR100499336(B1)	申请公布日期	2005.09.02
申请号	KR19980028116	申请日期	1998.07.13
申请人		发明人
分类号	H01L23/10;(IPC1-7):H01L23/10	主分类号	H01L23/10
代理机构		代理人
主权项
地址

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