| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of resisting heat or pressure in a transfer mold process and blocking entering of sealing resin into a non-through conduction hole in sealing an electronic component by resin into a chip component having an end-face electrode. SOLUTION: In a wiring board 1, insulating resin 6 is filled in the appropriately upper half of the inside of a non-through conduction hole 7. On an end face below the insulating resin filled in the non-through conduction hole, an end face electrode 9 is formed which is depressed in approximately uniform depth from the lower end of the non-through conduction hole. In the non-through conduction hole for forming the end face electrode, hole size at the upper end face of the hole can be made larger than hole size at the lower end face of the hole. COPYRIGHT: (C)2006,JPO&NCIPI
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